Allwinner T113

Smart control and display SoC

Overview

Allwinner T113 is an advanced application processor. It integrates dual-core Cortex-A7 CPU, RISC-V, and single-core HiFi4 DSP to provide highly efficient compute power. Allwinner T113 supports full format decoding such as H.265, H.264, MPEG-1/2/4, and JPEG. The independent hardware encoder can encode in JPEG or MJPEG. Integrated multi ADCs/DACs and I2S/PCM/DMIC/OWA audio interfaces can provide excellent voice interaction solution. Allwinner T113 comes with extensive connectivity to facilitate product expansion, such as CAN, USB, SDIO, EMAC, TWI, UART, SPI, PWM, GPADC, IR TX&RX, etc.

The following is the Allwinner T113 family differentiated features.

Feature T113-S2 T113-S3 T113M3010DC0  T113M4020DC0 T113M4030DC0 T113-i
RISC-V Not Supported Not Supported Supported Supported Supported Supported
DSP Not Supported Supported Supported Supported Supported Supported
DDR SIP DDR2 64MB SIP DDR3 128MB SIP DDR3 128MB SIP DDR3 256MB SIP DDR3 256MB External DDR
Package eLQFP 128

14mm x 14mm

eLQFP 128

14mm x 14mm

eLQFP 128

14mm x 14mm

eLQFP 128

14mm x 14mm

eLQFP 128

14mm x 14mm

LFBGA 337 balls

13mm x 13mm

LRADC Not Supported Not Supported Not Supported Not Supported Not Supported 1-ch
GPADC 1-ch 1-ch 1-ch 1-ch 1-ch 2-ch
Audio MICIN3P/N

FMINL/R

LINEINL/R

HPOUTL/R

MICIN3P/N

FMINL/R

LINEINL/R

HPOUTL/R

MICIN3P/N

FMINL/R

LINEINL/R

HPOUTL/R

MICIN3P/N

FMINL/R

LINEINL/R

HPOUTL/R

MICIN3P/N

FMINL/R

LINEINL/R

HPOUTL/R

MICIN1P/N MICIN2P/N MICIN3P/N

FMINL/R

LINEINL/R LINEOUTLP/N LINEOUTRP/N

HPOUTL/R

2 x I2S 2 x I2S 2 x I2S 2 x I2S 2 x I2S 3 x I2S
MIPI DSI Up to 720P@60fps Up to 1920x1200@60fps Up to 1920x1200@60fps Up to 1920x1200@60fps Up to 1920x1200@60fps Up to 1920x1200@60fps
Video decoding Up to 1080P@60fps Up to  1080P@60fps Up to  1080P@60fps Up to  1080P@60fps Up to  1080P@60fps Up to 4K@30fps

Highlights

Integrate dual-core Cortex-A7, RISC-V, single-core HiFi4 DSP, DDR, 3 ADCs, 2DACs, I2S/PCM, and 8 digital microphones, providing excellent voice interaction solution

H.265 full format decoding and Allwinner SmartColor 2.0 display enhancement technology, providing outstanding video experience

Rich display output interfaces such as RGB/LVDS/DSI/CVBS OUT meeting the requirements of screen display in differentiated markets

Advanced process design with lower voltage and lower leakage, power optimisation design for typical scenes, and enhanced heat dissipation package for better heating experience

Block diagram

 

Specifications

 

CPU

Dual-core ARM CortexTM-A7

- 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2

RISC-V CPU

- 32 KB I-cache + 32 KB D-cache

 

DSP

Single-core HiFi4

- 32 KB I-cache + 32 KB D-cache

 

Memory

DDR

SD3.0/eMMC 5.0, SPI Nor/NAND Flash

 

Video decoding

H.265, up to 4K@30fps (for T113-i), 1080p@60fps (for others)

H.264, up to 4K@30fps (for T113-i), 1080p@60fps (for others)

H.263, MPEG-1/2/4, JPEG, Xvid, Sorenson Spark, up to 1080p@60fps

 

Video encoding

JPEG/MJPEG up to 1080p@60fps

Support input picture scaler up/down

 

Display engine

Allwinner SmartColor2.0 post processing for excellent display experience

Support de-interlace (DI) up to 1080p@60fps

Support G2D hardware accelerator including rotate, mixer, lbc decompression

 

Video OUT

CVBS OUT interface, supporting NTSC and PAL format

RGB LCD output interface up to 1920 x 1080@60fps

Dual link LVDS interface up to 1920 x 1080@60fps

4-lane MIPI DSI interface up to 1920 x 1200@60fps

 

Video IN

8-bit parallel CSI interface

CVBS IN interface, supporting NTSC and PAL format

 

Audio

2 DACs and 3 ADCs

Analog audio interfaces:

- MICIN1P/N, MICIN2P/N, MICIN3P/N, LINEINL/R, LINEOUTLP/N, LINEOUTRP/N, FMINL/R, HPOUTL/R (for T113-i)

- MICIN3P/N, FMINL/R, LINEINL/R, HPOUTL/R (for others)

Digital audio interfaces: I2S/PCM, DMIC, OWA

 

Security system

AES, DES, 3DES encryption and decryption algorithms

RSA signature verification algorithm

MD5/SHA and HMAC tamper proofing

Hardware random number generator

Integrated 2 Kbits OTP storage space

 

Connectivity

USB2.0 OTG, USB2.0 Host

SDIO 3.0, SPI x 2, UART x 6, TWI x 4, CAN x 2

PWM (8-ch), GPADC, LRADC (only for T113-i), TPADC (4-ch), IR TX&RX

10/100/1000M EMAC with RMII and RGMII interfaces

 

Package

LFBGA 337 balls, 13mm x 13 mm (for T113-i)

eLQFP 128, 14mm x 14mm (for others)

 

Application diagram

The following diagram is for chips other than T113-i.

 

The following diagram is for T113-i only.