Smart control and display SoC
Overview
Allwinner T113 is an advanced application processor. It integrates dual-core Cortex-A7 CPU, RISC-V, and single-core HiFi4 DSP to provide highly efficient compute power. Allwinner T113 supports full format decoding such as H.265, H.264, MPEG-1/2/4, and JPEG. The independent hardware encoder can encode in JPEG or MJPEG. Integrated multi ADCs/DACs and I2S/PCM/DMIC/OWA audio interfaces can provide excellent voice interaction solution. Allwinner T113 comes with extensive connectivity to facilitate product expansion, such as CAN, USB, SDIO, EMAC, TWI, UART, SPI, PWM, GPADC, IR TX&RX, etc.
The following is the Allwinner T113 family differentiated features.
Feature | T113-S2 | T113-S3 | T113M3010DC0 | T113M4020DC0 | T113M4030DC0 | T113-i |
RISC-V | Not Supported | Not Supported | Supported | Supported | Supported | Supported |
DSP | Not Supported | Supported | Supported | Supported | Supported | Supported |
DDR | SIP DDR2 64MB | SIP DDR3 128MB | SIP DDR3 128MB | SIP DDR3 256MB | SIP DDR3 256MB | External DDR |
Package | eLQFP 128
14mm x 14mm |
eLQFP 128
14mm x 14mm |
eLQFP 128
14mm x 14mm |
eLQFP 128
14mm x 14mm |
eLQFP 128
14mm x 14mm |
LFBGA 337 balls
13mm x 13mm |
LRADC | Not Supported | Not Supported | Not Supported | Not Supported | Not Supported | 1-ch |
GPADC | 1-ch | 1-ch | 1-ch | 1-ch | 1-ch | 2-ch |
Audio | MICIN3P/N
FMINL/R LINEINL/R HPOUTL/R |
MICIN3P/N
FMINL/R LINEINL/R HPOUTL/R |
MICIN3P/N
FMINL/R LINEINL/R HPOUTL/R |
MICIN3P/N
FMINL/R LINEINL/R HPOUTL/R |
MICIN3P/N
FMINL/R LINEINL/R HPOUTL/R |
MICIN1P/N MICIN2P/N MICIN3P/N
FMINL/R LINEINL/R LINEOUTLP/N LINEOUTRP/N HPOUTL/R |
2 x I2S | 2 x I2S | 2 x I2S | 2 x I2S | 2 x I2S | 3 x I2S | |
MIPI DSI | Up to 720P@60fps | Up to 1920x1200@60fps | Up to 1920x1200@60fps | Up to 1920x1200@60fps | Up to 1920x1200@60fps | Up to 1920x1200@60fps |
Video decoding | Up to 1080P@60fps | Up to 1080P@60fps | Up to 1080P@60fps | Up to 1080P@60fps | Up to 1080P@60fps | Up to 4K@30fps |
Highlights
Integrate dual-core Cortex-A7, RISC-V, single-core HiFi4 DSP, DDR, 3 ADCs, 2DACs, I2S/PCM, and 8 digital microphones, providing excellent voice interaction solution
H.265 full format decoding and Allwinner SmartColor 2.0 display enhancement technology, providing outstanding video experience
Rich display output interfaces such as RGB/LVDS/DSI/CVBS OUT meeting the requirements of screen display in differentiated markets
Advanced process design with lower voltage and lower leakage, power optimisation design for typical scenes, and enhanced heat dissipation package for better heating experience
Block diagram
Specifications
CPU
Dual-core ARM CortexTM-A7
- 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2
RISC-V CPU
- 32 KB I-cache + 32 KB D-cache
DSP
Single-core HiFi4
- 32 KB I-cache + 32 KB D-cache
Memory
DDR
SD3.0/eMMC 5.0, SPI Nor/NAND Flash
Video decoding
H.265, up to 4K@30fps (for T113-i), 1080p@60fps (for others)
H.264, up to 4K@30fps (for T113-i), 1080p@60fps (for others)
H.263, MPEG-1/2/4, JPEG, Xvid, Sorenson Spark, up to 1080p@60fps
Video encoding
JPEG/MJPEG up to 1080p@60fps
Support input picture scaler up/down
Display engine
Allwinner SmartColor2.0 post processing for excellent display experience
Support de-interlace (DI) up to 1080p@60fps
Support G2D hardware accelerator including rotate, mixer, lbc decompression
Video OUT
CVBS OUT interface, supporting NTSC and PAL format
RGB LCD output interface up to 1920 x 1080@60fps
Dual link LVDS interface up to 1920 x 1080@60fps
4-lane MIPI DSI interface up to 1920 x 1200@60fps
Video IN
8-bit parallel CSI interface
CVBS IN interface, supporting NTSC and PAL format
Audio
2 DACs and 3 ADCs
Analog audio interfaces:
- MICIN1P/N, MICIN2P/N, MICIN3P/N, LINEINL/R, LINEOUTLP/N, LINEOUTRP/N, FMINL/R, HPOUTL/R (for T113-i)
- MICIN3P/N, FMINL/R, LINEINL/R, HPOUTL/R (for others)
Digital audio interfaces: I2S/PCM, DMIC, OWA
Security system
AES, DES, 3DES encryption and decryption algorithms
RSA signature verification algorithm
MD5/SHA and HMAC tamper proofing
Hardware random number generator
Integrated 2 Kbits OTP storage space
Connectivity
USB2.0 OTG, USB2.0 Host
SDIO 3.0, SPI x 2, UART x 6, TWI x 4, CAN x 2
PWM (8-ch), GPADC, LRADC (only for T113-i), TPADC (4-ch), IR TX&RX
10/100/1000M EMAC with RMII and RGMII interfaces
Package
LFBGA 337 balls, 13mm x 13 mm (for T113-i)
eLQFP 128, 14mm x 14mm (for others)
Application diagram
The following diagram is for chips other than T113-i.
The following diagram is for T113-i only.